Jungsik Kim received Ph.D. degree in IT Convergence Engineering from Pohang University of Science and Technology (POSTECH) in 2016. He worked as senior engineer in SK-Hynix from Feb. 2016 to Mar. 2018 for development of D1x DRAM and 96-stacks 3D NAND Flash Memory. He joined NASA Ames Research Center as postdoctoral researcher for studying the impact of radiation on silicon devices with numerical simulation modeling. From Apr. 2019 to Feb. 2020, he was senior engineer in Samsung Electronics (Memory Business) for developing design technology co-optimization (DTCO) system of D1a/D1b DRAM. From Mar. 2020, he is assistant professor of department of electrical engineering in Gyeongsang National University (GNU). He has contributed over 24 technical papers and presentations in research field of silicon memory and logic device modeling.

As an expert in transistor analysis due to radiation effect using numerical simulation (technology computer aided design, TCAD), the speaker give a talk about the radiation effect on various silicon transistors such like DRAM, IGBT, and logic transistor (FinFET, nanosheet FET). The presentation includes the result of soft-error (single event response) and hard-error (displacement damage) in silicon transistor level. Based on TCAD simulation result, we can understand the various patterns due to radiation in silicon FETs.

Hosang Yi received B.S. degree in Electronics Engineering from Ajou University, Korea, in 2000. Since 2000, he joined Asia Pacific Satellite Inc, where he has designed electronic units and test equipment for space applications and managed high-reliable EEE engineering over 12 years. He was system engineer of multiple KOMPSAT (Korean Multi-Purpose Satellite) projects and project manager of CAS500 SBMU project.

As new generation of middle size satellite in public sector, CAS500 (Compact Advanced Satellite 500kg) has been designed. On-Board Computer of CAS500, SBMU (Standard Bus Management Unit), has been issued and designed to meet its high capability, performance and dimensional requirements. Accordingly, new, industrial and radiation-sensitive components have been introduced, tested and up-screened for Flight Model. Test and screening methods had determined with reliability assessment and environmental requirement and radiation performance has been taken into account on component level considering its hardware applications. This presentation brings strategy of EEE part selection and cases of components test and evaluation for high-reliability and space application in CAS500.

Jyotika Athavale is a Senior Technical Leader in Functional Safety at NVIDIA. Prior to this role, she worked as Principal Engineer and lead Functional Safety Architect at Intel Corporation. She is a recognized industry expert with in-depth technical knowledge of platform technologies and architectures for Automotive, Transportation and Avionics Safety Critical Systems, with specific expertise in radiation effects modeling for soft-errors performance. Based in the US, her 24 years of industry career experience in the semiconductor and EDA industry has spanned technical leadership positions as well as management roles. Jyotika is currently leading and influencing international standards activities in the area of functional safety and dependability. She chairs the IEEE P2851 WG standard on functional safety interoperability and is a board member of the IEEE Computer Society Board of Governors. She is also a Distinguished Visitor with the IEEE Computer Society and is an IEEE Senior Member. Jyotika has authored several IEEE publications and is a core team member of the IEEE Computer Society Special Technical Community for Reliable, Safe, Secure and Time Deterministic Intelligent Systems. She holds a master’s degree in electrical engineering from Iowa State University.

This presentation will explore the functional safety landscape, requirements, and the implications and considerations needed to model, measure and mitigate for radiation effects in AV systems. This includes the role of vulnerability factor models for functional safety performance, beam-testing methodologies and the needed mitigations at a technology, SoC and system level. This presentation will also review the current state of functional safety standardization activities, including the IEEE P2851 standard on functional safety interoperability.

The automotive industry is advancing at a rapid pace. The innovations in self-driving technology and functional safety is becoming more than a value added feature in customer’s minds, and is becoming more expected as a must-have feature.
Memory is one of the key enablers for Autonomous Driving. Achieving the next level of automation, infotainment, and connectivity requires computational power, which can be delivered by Memory’s bandwidth and capacity.
More than one million lives are lost each year in traffic-related accidents. However, in the near future, Autonomous driving and diverse safety features will dramatically cut that number for sure. To raise the quality and reliability of the driving experience in automobiles of the future, SK hynix, as a proven memory partner, is striving to obtain robust qualification beyond AEC_Q100 as well as ISO26262 Functional Safety, while considering and reflecting customers’ requirements.
This session will talk about SK hynix’s view on Automotive memory market and design consideration in terms of functional safety application.
Keith Jangryul Kim is director and Team leader of DRAM technical marketing in DRAM Technology group in SK hynix America.
He has been with SK hynix for 15 years and has experience in DRAM design, Test Engineering and Product Planning. He was leading SK hynix JEDEC Memory specification for 6years and He was JEDEC Committee, DRAM function and feature Chairman. His current focus is enabling DDR/LPDDR/GDDR/HBM memory evaluation and designing / Path-finding future memory concepts, technologies like Post DDRx, LPDDRx, HBMx and CXL Type3 memory expansion.

Power Device demand has increased dramatically when automotive industry started to introduce smart and autonomously driving vehicles into market. Stringent requirement of the automotive safety and new market demand drove much needed research and development of various types of power devices. Among those device power technologies, the most promising technology is in the SiC power devices.
The topic “Power Semiconductor for Automotive Application: How safe is Safe Operating Area (SOA)?” outlines reliability implications from terrestrial neutron induced Single Event Effect (SEE), especially for Sing Event Latch-up (SEL), including Single Event Burnout (SEB) and Single Event Gate Rupture (SEGR) phenomenon. The topic also discusses different mitigation solutions to meet the functional safety requirement of the ISO26262.

Dr. Stephen Wender is Technical Project Manager in the Physics Division at the Alamos Neutron Science Center (LANSCE) at the Los Alamos National Laboratory. His research interests include using neutrons to address a wide range of issues in basic and applied science. Recently his interests include radiation effects in semiconductor electronics and developing the facilities and techniques to test semiconductor devices for neutron-induced failures. He has developed and operated the LANSCE facilities for terrestrial neutron testing and has been developing detectors for thermal neutron and other particles at aircraft altitudes.
Semiconductor devices are used in all aspects of modern life and the reliability of these devices is a major concern and may limit their applicability and performance. LANSCE is a flexible source of radiation that can be used effectively to address many aspects of this problem, especially to testing and characterization of single event effects (SEE) from the terrestrial neutrons. New capabilities for radiation effects will be discussed in this presentation and describe several areas where LANSCE capabilities are presently being used and areas where LANSCE can expand its role by expanding and upgrading its facilities.

Last two years have been difficult socially and economically for every countries. Technical challenges the industry facing are two folds, the first is meeting the demands for transiting automotive industries for more greener electric vehicles and the second is providing reliability requirement of the functional safety for the new device types. There are increase in radiation test demands, diversity device types, and test requirements.
The presentation brings four key points to address the status of various standards requiring soft error test, how the test is performed & the data is analyzed, what are the critical issues for the industry to manage the transition well.